Universal memory module/PCB storage, transport, automation handling tray

ABSTRACT

An adjustable tray for a semiconductor device, and method of using the tray for handling the device, are provided. Each tray comprises a front frame segment and a back frame segment opposing the front frame segment, and a pair of opposing side frame segments secured to the front and back frame segments to form right angles, each side frame segment containing a longitudinal channel. Each tray further includes a fixed locator segment and an adjustable locator segment, each having a plurality of slots for receiving semiconductor devices therein. The distal ends of the locator segments are secured to the pair of opposing side frame segments at right angles. The adjustable locator segment can be manipulated such that the fixed and adjustable locator segments are spaced apart a distance commensurate with the width of the semiconductor device. The device is friction fit into a slot such that the device is only contacted at keep-out areas on the device. Using stand-offs mounted in stand-off receptacles, two or more trays can be modularly stacked.

FIELD OF THE INVENTION

This invention relates in general to handling semiconductor substratetrays and, more particularly, to a modularly stackable, adjustable trayfor storing, transporting, and handling a semiconductor integratedcircuit device.

BACKGROUND OF THE INVENTION

Various techniques have been developed for the storing, transporting,and handling of semiconductor integrated circuit devices. Manysemiconductor devices, such as printed circuit boards, are expensive anddelicate. Accordingly, they must be carefully handled after processingfor storage and shipment. Such boards can be fragile under loads appliedto the surface of the board that typically carries components. Sincesuch semiconductor devices are rather resistant to end loads orcompression forces that act edgewise upon the board, the concept ofslotted devices for holding and transporting semiconductor devices hasbeen conventionally used.

For example, U.S. Pat. No. 3,664,510 (Kerschbaum) shows a card cage forprinted circuit cards in which flexible plastic members are mounted in ametal frame to hold the printed cards in place in a verticalorientation. Further, U.S. Pat. No. 3,458,767 (Hedger) shows a rack thathas opposed rows of parallel guides into which circuit boards can beslid into place. These holders are typical of the type of devices usedto hold circuit boards. However, the holders are not adjustable toaccommodate varying substrate sizes.

One circuit board holder having adjustable compartments is described inU.S. Pat. No. 4,158,876 (Pedro). However, Pedro requires that thecircuit boards be secured by sliding opposing edges of the board throughopposing elongated recesses. Such extensive contact can cause damage tocomponents on the board. Also, since the board merely rests on a lowerlip of the compartment when inserted, only the pull of gravity on theboard can keep the board secure. Furthermore, the holder in Pedro is notstackable.

Given these limitations of the prior art, there is a clear need for animproved tray for storing, transporting, and handling semiconductordevices.

SUMMARY OF THE INVENTION

The present invention provides a universal memory module/printed circuitboard storage, transport, and automation handling tray. In one aspect inparticular, the invention comprises an adjustable tray for semiconductordevices.

In one embodiment, the semiconductor device trays comprise opposingfront and back frame segments, opposing side frame segments containing alongitudinal channel, a fixed locator segment secured to the tray, andan adjustable locator segment temporarily secured to the longitudinalchannel. In these embodiments, both the fixed locator segment and theadjustable locator segment comprise distal ends and slots for receivingthe semiconductor devices. The distal ends have a guide element that isreceived by the longitudinal channels.

In one embodiment, a middle portion of the slots in the locator segmentshas a slot width that ensures the semiconductor device is friction fitwhen placed into the slots. As the semiconductor devices are received bythe tray, contact between the devices and the slots is restricted tokeep-out areas. As such, components on the semiconductor device do notcontact the tray.

In another embodiment, the adjustable locator segment is moved withrespect to the fixed locator segment such that the distance between thetwo segments corresponds to the width of the semiconductor device. In afurther embodiment, the tray pitch present on the locator segments isgreater than the aggregate thickness of the semiconductor device. Insuch embodiments, the tray pitch is the distance between adjacent slotson a locator segment, and the aggregate thickness is the thickness ofthe semiconductor device and any protruding components disposed on thedevice.

In yet another embodiment, the front, back, and opposing side framesegments can include stand-off receptacles. The stand-off receptaclesare configured to receive and removably secure stand-offs so that asecond adjustable semiconductor tray can be mounted on the stand off ofa first tray. Mounting in this fashion provides vertical separationbetween the two (or more) adjustable semiconductor trays. In anotherembodiment, the opposing side frame segments provide the verticalseparation. In these embodiments, the side frame segments extendupwardly from a first tray and are received by a second tray mounted onthe first. The side frame segments are taller than the height of thedevice.

In one embodiment, the fixed locator segment is secured to the frontframe segment and/or the opposing side frame segments. In anotherembodiment, the guide element can be a salient, a tongue, a detent, adove-tail, a gear, a roller, a pulley, a flange, and/or a ball. In suchembodiments, the longitudinal channels can contain a mating guideelement that is a gear, a chain, a belt, ball bearings, and/or alubricant.

In a further embodiment, the tray comprises a locking mechanism fortemporarily securing the adjustable locator segment. In still otherembodiments, the front, back, opposing side, fixed locator, andadjustable locator segments comprise one or more static dissipatingmaterials such as Semitron ESD 225, a trademark for a static dissipativeacetal.

In another embodiment of the present invention, the trays compriseopposing front and back frame segments, opposing side frame segmentscontaining a longitudinal channel, a fixed locator segment secured tothe tray, and an adjustable locator segment temporarily secured to thelongitudinal channel. In these embodiments, both the fixed locatorsegment and the adjustable locator segment comprise distal ends andslots for receiving semiconductor devices therein. The distal ends havea guide element that is received by the longitudinal channels. When theslots receive the semiconductor devices, the devices are temporarilysecured by a friction fit, and contact between a device and a slot isrestricted to the keep-out areas. The keep-out areas can comprise aportion of one or more lower peripheral regions of a semiconductordevice that is devoid of electrical components.

In another embodiment, the slots of the fixed locator segment and/or theadjustable locator segment can comprise slot walls with an upper portionthat is tapered, rounded, or otherwise configured to assist in guiding asemiconductor device into the slot. In further embodiments, anadjustable locator segment is moveable, with respect to the fixedlocator segment, to correspond to the width of the semiconductor device.In still further embodiments, when received and secured in a tray, thesemiconductor devices are transverse to the tray.

In still another embodiment, the tray comprises opposing front and backframe segments and opposing adjustable locator segments. In suchembodiments, each side frame segment contains a longitudinal channel andis secured to the front frame segment and/or the back frame segment.Further, the opposing adjustable locator segments comprise distal endsand slots for receiving semiconductor devices. In these embodiments, thedistal ends have a guide element that is received by, and temporarilysecured within, the longitudinal channel.

In yet another embodiment, the opposing adjustable locator segments areadjustable such that the distance between the opposing locator segmentscorresponds to the width of a semiconductor device.

Another aspect of the present invention provides a modular tray system.In one embodiment, the system comprises semiconductor devices havingelectrical components disposed thereon and at least two trays forreceiving the devices therein. In such embodiments, the semiconductordevice trays comprise opposing front and back frame segments, opposingside frame segments containing a longitudinal channel, a fixed locatorsegment secured to the tray, and an adjustable locator segmenttemporarily secured to the longitudinal channel. In these embodiments,both the fixed locator segment and the adjustable locator segmentcomprise distal ends and slots for receiving the semiconductor devicestherein. The distal ends have a guide element that is received by thelongitudinal channels. In these aspects of the system, the two (or more)adjustable semiconductor device trays are modularly stacked upon oneanother.

In another embodiment, the system comprises a locking mechanism fortemporarily securing the two (or more) modularly stacked trays.

Another aspect of the present invention involves a method of handlingone or more semiconductor devices. In one embodiment, the methodcomprises providing semiconductor devices having electrical componentsdisposed thereon, providing a tray, and manipulating an adjustablelocator segment in the tray such that a fixed locator segment and theadjustable locator segment are spaced apart a distance commensurate withthe thickness of the semiconductor devices. Then, the semiconductordevices are inserted into the tray with a friction fit. Thereafter, oneor more additional trays can be provided and modularly stacked afterhaving received semiconductor devices. In a further embodiment, theadjustable locator segment is manipulated (or moved) by a person. Instill further embodiments, the manipulating, inserting, and securingacts can at least partially be performed in an automated, computercontrolled process.

In another embodiment, method comprises processing semiconductor devicesusing an adjustable tray. In one embodiment, the method comprisesdetermining the thickness, the aggregate thickness, and the width of asemiconductor device and selecting two locator segments based on thesedetermined measurements. In these embodiments, each of the slotsdisposed within the fixed and/or adjustable locator segments has a slotwidth smaller than the thickness of the semiconductor device. Further,adjacent slots disposed within the fixed and/or adjustable locatorsegments have a tray pitch larger than the aggregate thickness of thesemiconductor device. Thereafter, the two locator segments are insertedinto a frame assembly by aligning guide elements on the locator segmentswith opposing channels in side frame segments in the frame assembly. Theguide elements are then urged forward into the opposing channels of theside frame segments. The back frame member of the tray is then securedto the frame assembly. The two locator segments are adjusted such thatthe distance between the two locator segments corresponds with the widthof semiconductor devices. The semiconductor devices are then secured inthe slots by inserting keep-out areas of the semiconductor devices intothe slots to create a friction fit.

In another embodiment, the method further comprises inserting stand-offsinto stand-off receptacles that are disposed on the frame assembly suchthat one or more adjustable semiconductor trays can be modularlystacked. In another embodiment, each slot in the fixed and/or adjustablelocator segment comprises opposing slot walls that produce a fiction fitwhen the semiconductor device is inserted between the walls of the slot.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are described below with reference to thefollowing accompanying drawings, which are for illustrative purposesonly. The invention is not limited in its application to the details ofconstruction or the arrangement of the components set forth in thefollowing description or illustrated in the drawings. The invention iscapable of other embodiments or of being practiced or carried out inother various ways. Also, it is to be understood that the terminologyand phraseology employed herein is for purpose of description andillustration and should not be regarded as limiting. Like referencenumerals are used to indicate like components.

FIG. 1 is a perspective view of an embodiment of an adjustable,modularly stackable tray with a semiconductor device secured thereinaccording to the invention.

FIG. 2 is a perspective view (partially exploded) of the frame assemblyand stand-offs of the tray of FIG. 1.

FIG. 3 is a perspective view of the longitudinal channel in each sideframe segment in the frame assembly of FIG. 2.

FIG. 4 is a perspective view of a locator segment in the tray of FIG. 1illustrating a plurality of slots.

FIG. 5 is a perspective view of a slot disposed within the locatorsegment of FIG. 4.

FIG. 6 is a front, elevational view of the slot of FIG. 5 illustratingthe slot thickness and longitudinal axis.

FIG. 7 is a top, plan view of a portion of the locator segment of FIG. 4illustrating the tray pitch.

FIG. 8 is a perspective view of an end of the locator segment of FIG. 4.

FIG. 9 is a top, plan view (partially exploded) of the frame assembly ofFIG. 2 illustrating locator segments (FIG. 4) within the frame assembly.

FIG. 10 is a front, elevational view of an embodiment of a semiconductordevice for insertion into the tray of FIG. 1.

FIG. 11 is a side, elevational view of the semiconductor device of FIG.10.

FIG. 12 is a cut-away portion of the semiconductor device of FIG. 10,highlighting the keep-out area on the semiconductor device.

FIG. 13 is a perspective view (exploded) of an additional adjustable,modularly stackable tray being stacked upon the tray of FIG. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The invention will be described generally with reference to the drawingsfor the purpose of illustrating the present preferred embodiments onlyand not for purposes of limiting the same.

In the current application, the terms “semiconductive wafer fragment” or“wafer fragment” or “wafer” will be understood to mean any constructioncomprising semiconductor material, including but not limited to bulksemiconductive materials such as a semiconductor wafer (either alone orin assemblies comprising other materials thereon), and semiconductivematerial layers (either alone or in assemblies comprising othermaterials). The term “substrate” refers to any supporting structureincluding, but not limited to, the semiconductive wafer fragments orwafers described above. As used herein, the terms “front”, “back”,“top”, and “bottom” are used for illustrative purposes only and are notmeant to limit the description of the invention in any way.

In the illustrated example, a semiconductor device known as a printedcircuit board (PCB) will be used to describe the invention, althoughother conventional semiconductor devices known in the microelectronicsor semiconductor industry can be used in connection with the describedtray.

Referring to FIG. 1, an embodiment of an adjustable, modularly stackabletray 2 according to the invention is illustrated. The tray 2, comprisinga frame 4 constructed of frame segments 6, 8, 10, is shown securing asemiconductor device 12 within the slots 14 of locator segments 16, 18.The semiconductor device 12, bearing several attached electricalcomponents 20, is vertically oriented with respect to the horizontallyoriented tray 2. Also, FIG. 1 illustrates a plurality of stand-offs 22located proximate corners 24 of the tray 2.

Frame 4, employed by tray 2 in FIG. 1, is depicted partially assembledand in more detail in FIG. 2. As FIG. 2 shows, frame 4 comprises a first(front) frame segment 6, a second (back) frame segment 8, and a pair ofopposing side frame segments 10. Each of these four segments 6, 8, 10will be secured together to erect frame 4. As shown, an end 28 of oneside frame segment 10 is secured to front frame segment 6 proximate afirst end 26 of front frame segment. Similarly, an end 28 of opposingside frame segment 10 is secured to front frame segment 6 proximate asecond end 30 of the front frame segment. Thus, three of the segments 6,10 of frame 4 are secured together.

Back frame segment 8 is illustrated prior to being secured to theremaining segments 6, 10. Back frame segment 8, like front frame segment6, will eventually be secured to the ends 28 of opposing side segments10 to complete frame 4. An end 28 of one side frame segment 10 will besecured to back frame segment 8 proximate a first end 32 of the backframe segment. Likewise, another end 28 of an opposing side framesegment 10 will be secured to back frame segment 8 proximate a secondend 34 of the back frame segment. As such, when frame 4 is assembled,front and back frame segments 6, 8 oppose each other. The four joinedsegments 6, 8, 10 form right angles when positioned in a common,horizontal plane. Typically, when perceived from a top plan view such asshown in FIG. 9, the combination of segments 6, 8, 10 takes the shape ofa square or rectangle. Each of the segments 6, 8, 10 can be constructedby a machining or molding technique, such as vacuum molding, and aretypically made from a static dissipating material such as Semitron ESD225, ABS plastic (carbon impregnated), and the like.

Each side frame segment 10 contains a longitudinal channel 36 therein asillustrated in FIG. 3. The longitudinal channel 36 typically extendswithin the entire length of a side frame segment 10, although thechannel can be limited to a portion of the length. However, at least oneend 28 of a side frame segment 10 provides an end channel opening 38.The end 28 with the end channel opening 38 is preferably disposedtowards back frame segment 8. Referring back to FIG. 2, when frame 4 oftray 2 is assembled, the channel 36 found within each side frame segment10 faces inwardly. Thus, the channels 36 on opposing side frame segments10 face and oppose each other.

One of the two similar locator segments 16, 18 of FIG. 1 is depicted indetail in FIG. 4. Like frame segments 6, 8, 10, locator segments 16, 18can be constructed by a machining or molding technique and are typicallymade from a static dissipating material such as Semitron ESD 225.Locator segments 16, 18 each comprise an elongate member, containing aplurality of slots 14 therein, having a guide element 40 proximate eachend 42. As FIG. 4 illustrates, slots 14 within locator segments 16, 18are arranged substantially along the entire length of the locatorsegments. Furthermore, the slots 14 open toward a top surface 44 and aredisposed toward a front surface 46 of the locator segments 16, 18 suchthat each slot 14 comprises a top surface opening 48 and a front surfaceopening 50. The slots 14 are shown in greater detail in FIGS. 5–7.

As illustrated in FIG. 5, slots 14 have a top surface opening 48 on thetop surface 44 of locator segments 16, 18 and extend downwardly towardthe bottom surface 52 of the locator segments. Typically, slots 14 donot penetrate bottom surface 52 of locator segments 16, 18. Likewise,slots 14 have a front surface opening 50 on the front surface 46 oflocator segments 16, 18 and extend inwardly toward back surface 54 ofthe locator segments. Again, typically slots 14 do not penetrate backsurface 54 of the locator segments 16, 18. In one embodiment, asillustrated in FIGS. 5 and 6, an upper portion 56 of slot 14 has slotwalls 58 that are tapered from the top surface 44 towards the bottomsurface 52 until the slot walls reach a middle portion 60 of the slot.In other embodiments, the slot walls 58 at the upper portion can berounded, concave, convex, funnel-shaped, conical or the like to guidethe device 12 into slot 14. At middle portion 60, opposing slot walls 58become vertically oriented and again extend towards the bottom surface52 until reaching a lower portion 62 of slot 14. At the middle portion60 of slot 14, as illustrated in FIG. 6, the distance between opposingslot walls 58 defines a slot width 64. Lower portion 62 of slot 14 canbe expanded and become hemispherical or similarly shaped.

As further illustrated in FIG. 6, each slot 14 has a longitudinal axis66. The distance between the longitudinal axis 66 of adjacent slots 14,14 a, defines a tray pitch 68 as illustrated in FIG. 7. In oneembodiment, the tray pitch 68 between adjacent slots 14, 14 a on thelocator segments 16, 18 is kept constant over the entire length of thelocator segment. However, tray pitch 68 can be varied over the length ofthe locator segments 16, 18, as desired.

Referring to FIG. 8, the locator segments 16, 18 further comprise aguide element 70 proximate each end 42 of the locator segments. Guideelement 70 typically comprises a protruding portion of, or addition to,end 42 of locator segments 16, 18. In the embodiment shown in FIG. 8,guide element 70 is illustrated as a protruding salient. The protrudingsalient guide element 70 is configured to correspond to, and fit within,channels 36 of side frame segments 10. As such, frame 4 can receive oneor more locator segments 16, 18 within channels 36 when guide elements70 on ends 42 of the locator segments are aligned with the channels inthe side frame segments 10. In other embodiments, the guide element 70can comprise, for example, a detent, a tongue, a dove-tail, a gear, aroller, a pulley, a flange, or a ball. In such embodiments, channel 36will generally contain therein, for example, a gear, a chain, a belt,ball bearings, a lubricant, or other mating guide element (not shown) tocomplimentarily and correspondingly receive the particular selectedguide element 70.

FIG. 9 illustrates two locator segments 16, 18 as received by partiallyassembled frame 4. Guide element 70 on each end 42 of locator segments16, 18 is aligned with, and inserted into, channel 36 of each opposingside frame segment 10. The locator segments 16, 18 are then slid alongchannels 36 and into position inside frame 4. In one embodiment, onelocator segment 16 is fixed while the other locator segment 18 isadjustable. As shown in FIG. 1, back surface 54 of fixed locator segment16 can be secured to front frame segment 6. In other embodiments, theends 42 of the fixed locator segment 16 can be secured to opposing sideframe segments 10 at or near front frame segment 6 as illustrated inFIG. 9.

Adjustable frame locator segment 18 can be moved, via guide elements 70within channels 36, toward or away from fixed locator segment 16 asshown by directional arrows 98, 100. As such, the distance betweenlocator segments 16, 18 can be increased or decreased as desired. Alocking mechanism (not shown) such as a set screw, a spring-loaded pin,and the like, attached to opposing side frame segments 10 can beemployed to temporarily secure the adjustable locator segment 18 in aparticular location once a desired position is achieved.

In another embodiment, both locator segments 16, 18 are adjustable. Suchan arrangement provides an increased ability to situate locator segments16, 18 within the tray and relative to one another. Also, by using twoadjustable locator segments 16, 18, semiconductor devices 12 securedtherein can be centered within tray 2 to bolster the stability of thetray.

An embodiment of a semiconductor device 12 with attached components 20is illustrated in greater detail in FIG. 10. As shown, device 12 has aknown and measurable width 72 and height 74. Also, FIG. 11 illustratesthe semiconductor device 12 in profile where the device has a known andmeasurable thickness 76. Furthermore, the device 12 has an aggregate(total) thickness 78 defined by the thickness of the device 12 includingthe electrical components 20 disposed thereon. Electrical components 20can protrude from a semiconductor device surface 80. Therefore, thethickness of the components on the surface of the device is accountedfor in determining aggregate thickness 78.

Referring to FIG. 12, semiconductor device 12 further comprises keep-outareas 82. Keep-out areas 82, which are highlighted in FIG. 12 bydiagonal hatching, typically occur proximate the lower, peripheralregions 84 of device 12. The keep-out areas 82 are so named because thekeep-out areas are devoid of any electrical components 20 or otherfragile semiconductor elements (not shown) that can be easily damagedduring the handling of the device. Thus, if physical contact with device12 is required, it is preferred that the contact be limited to keep-outareas 82 to ensure the integrity of the device and any devicecomponents.

Referring back to FIGS. 1 and 2, a plurality of stand-offs 22 areillustrated. Each stand-off 22 comprises an elongate member having acentral portion 86, with a larger diameter, and distal end portions 88,with smaller diameters, thereby creating circumferential shoulders 90.Although a cylindrical stand-off 22 is illustrated, the stand-offs cantake a variety of different shapes. Central portion 86 can be comprisedof a variety of lengths, however, the central portion is preferablygreater than the height 74 of the semiconductor device 12 to facilitatemodular stacking while avoiding damage to the device. Within both thetop 92 and the bottom 94 of each side frame segment 10, a plurality ofstand-off receptacles 96 are illustrated. The stand-off receptacles 96can be generally located near ends 28 of the opposing side framesegments. Each of the stand-off receptacles 96 is configured to receivea stand-off 22, the stand-off being received by the stand-off receptacleuntil penetration is halted by the circumferential shoulder 90. Byutilizing a plurality of stand-offs 22 in combination with stand-offreceptacles 96, one or more trays 2 can be modularly stacked.

In another embodiment, a pair of upwardly, and vertically extending,opposing side frame segments (not shown) can be utilized instead ofstand-offs 22 and stand-off receptacles 96. The height of side framesegments in these embodiments is preferably greater than the deviceheight 74 to facilitate modular stacking while avoiding damage to thedevice. In such embodiments, bottom 94 of side frame segments 10 wouldreceive a portion of top 92 of side frame segments from an additionaltray. In another embodiment, each of the front, back, and opposing sideframe segments 6, 8, 10 can contain therein a plurality of stand-offreceptacles 96 (not shown).

With the components of the tray outlined, an embodiment of a method ofusing the tray according to the invention can be articulated. Thesemiconductor device 12 to be stored, handled, transported, or otherwiseprocessed is selected. Thereafter, the thickness 76 of device 12 isdetermined. The aggregate thickness 78 of device 12 and any components20 is then determined. Next, appropriate locator segments 16, 18 areselected based on thickness 76 and aggregate thickness 78. As anexample, an appropriate locator segment is one where slot width 64 isslightly smaller than device thickness 76 and tray pitch 68 is slightlylarger than aggregate thickness 78.

After locator segments 16, 18 are selected, the segments are introducedinto the partially assembled frame 4 as depicted in FIG. 9. Guideelements 70 on each end of locator segments 16, 18 are aligned withchannels 36 in opposing side frame segments 10. Upon alignment, guideelements 70 are inserted into the channels 36. Thereafter, back framesegment 8 is secured to remaining frame segments 6, 10 to form frame 4of tray 2.

The semiconductor device 12 is examined and device width 72 isascertained. Generally, as shown in FIG. 10, the device width 72 ismeasured from one lower peripheral region 84 to another. Notably, thekeep-out areas 82 are located within these lower peripheral regions 84to ensure that no components 20 or other fragile parts are near wheredevice 12 and tray 2 contact each other. After device width 72 isdetermined, one (or more locator segments 16, 18 are adjusted as neededto correspond to the width. Preferably, the one or more locator segments16, 18 are manipulated until the distance between the locator segmentsis substantially equal to device width 72. After an appropriate distancehas been established, one or more of locator segments 16, 18 are securedin that position.

With locator segments 16, 18 positioned and secured, tray 2 is ready toaccept the insertion of semiconductor device 12. To commence insertion,the keep-out areas 82 found in the lower peripheral regions 84 of avertically oriented device 12 are aligned with a corresponding pair ofslots 14 on opposing locator segments 16, 18 in a horizontally orientedtray 2. With the distance between locator segments 16, 18 having beendetermined with respect to width 72, alignment can be easilyaccomplished. Keep-out areas 82 are guided into slots 14 at top surfaceslot openings 48 while tapered upper portions 56 of the slots assist insliding and positioning, or funneling, device 12 toward the middleportion 60 of the slots. As keep-out areas 82 pass into middle portion60 of slots 14, a friction fit of device 12 in slot 14 is accomplished.This result transpires because each slot width 64 is slightly smallerthan the device thickness 76. Device 12 continues to be urged into eachslot 14 until the device completely extends through lower portion 62 ofeach slot. Thus, only keep-out areas 82 of device 12 are contacted as afriction fit is accomplished and the device is secured in tray 2.

As one or more devices 12 are secured in a tray 4, it may becomedesirable to enlist additional trays 4 a as illustrated in FIG. 13. Forexample, where a dimension 72, 74, 76, 78 of device 12 changes, or wheretray 4 is filled with semiconductor devices, the use of additional trays4 a may become desirable. However, dealing with these extra trays 4 acan make transportation, storage, or handling cumbersome if the traysare not sufficiently managed. Preferably, trays 4, 4 a can be modularlystacked. To stack trays 4, 4 a, a plurality of stand-offs 22 areinserted into stand-offs receptacles 96 located on top 92 of an opposingside frame segment 10 in tray 4. Center portion 86 of stand-off 22preferably exceeds height 74 of device 12 so that damage to the devicedoes not occur upon stacking. When completely inserted, shoulders 90 ofstand-offs 22 will be in contact with top 92. Thereafter, the stand-offreceptacles 96 a on the bottom 94 a of an additional tray 4 a arealigned with stand-offs 22 extending upwardly from the first tray 4. Theadditional tray 4 a is then lowered such that the stand-offs 22 on thefirst tray 4 are received by stand-off receptacles 96 a on theadditional tray 4 a. When completely inserted, shoulders 90 ofstand-offs 22 will be in contact with the bottom 94 a of additional tray4 a. As this process is repeated, multiple additional trays can bemodularly stacked.

Despite the above step being outlined in a step-by-step sequence, thecompletion of the acts in a particular chronological order is notmandatory. Several of the acts can be undertaken and accomplished atdifferent times to achieve a tray according to the invention.

In compliance with applicable statutes, the invention has been describedin language more or less specific as to structural and methodicalfeatures. It is to be understood, however, that the invention is notlimited to the specific features shown and described, since the meansherein disclosed comprise preferred forms of putting the invention intoeffect. The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

1. An adjustable tray for a semiconductor device, comprising: a frontsegment and opposing back segment being spaced apart; a first sidesegment and opposing second side segment being spaced apart and securedto the front and back segments to form a frame, at least one sidesegment comprising a longitudinal channel extending a length of saidside segment; and a first locator segment and opposing second locatorsegment being spaced apart and structured to cooperate for supporting asemiconductor device in a perpendicular orientation therebetween, atleast one locator segment comprising a distal end having a guide elementengaged with the longitudinal channel for slidably moving said locatorsegment along a length of the longitudinal channel.
 2. The adjustabletray of claim 1, wherein the frame is substantially rectilinear.
 3. Theadjustable tray of claim 1, wherein each of the side segments comprise alongitudinal channel along the length of the side segment, with aslidably-moveable element of said locator segment engage with each ofsaid channels.
 4. The adjustable tray of claim 1, wherein each of thelocator segments comprise a slidably-moveable element engaged with thelongitudinal channel.
 5. The adjustable tray of claim 1, wherein each ofthe side segments comprise a longitudinal channel along the length ofthe side segment, with a slidably moveable element of each of thelocator segments engaged with each of said channels.
 6. The adjustabletray of claim 1, wherein the one or more locator segments are removablysecured to the frame.
 7. The adjustable tray of claim 1, wherein each ofthe locator segments are slidably engaged with the channel.
 8. Theadjustable tray of claim 1, wherein the locator segments comprises oneor more slots for receiving the semiconductor device therein.
 9. Theadjustable tray of claim 8, wherein the one or more slots on the locatorsegments oppose one another for aligning the semiconductor device. 10.The adjustable tray of claim 1, wherein the guide element is selectedfrom a group consisting of a salient a tongue, a detent a dove-tail, agear, a roller, a pulley, a flange, and a ball.
 11. The adjustable trayof claim 1, wherein the longitudinal channel comprises a mating guideelement for receiving the guide element therein.
 12. The adjustable trayof claim 11, wherein the mating guide element is selected from the groupconsisting of a gear, a chain, a belt, ball bearings, and a lubricant.13. An adjustable tray for a semiconductor device, comprising: a frontsegment and an opposing back segment being spaced apart; a first sidesegment and opposing second side segment being spaced apart and securedto the front and back segments to form a frame, at least one sidesegment comprising a longitudinal channel extending a length of saidside segment; and a first locator segment and opposing second locatorsegment being spaced apart and structured to cooperate for supporting asemiconductor device in a perpendicular orientation therebetween, atleast one locator segment comprising a distal end having an elementremovably engaged with the longitudinal channel and slidably moveablealong a length of the longitudinal channel; and an element structuredfor stacking an additional tray thereon.
 14. The adjustable tray ofclaim 13, wherein the element for stacking the additional tray comprisesone or more stand-offs situated on the frame of the adjustable tray. 15.The adjustable tray of claim 13, wherein the element for stacking theadditional tray comprises one or more receptacles situated on the frameof the adjustable tray for matingly receiving stand-offs situated on theadditional tray.
 16. The adjustable tray of claim 13, wherein theelement for stacking is situated on the front and back segments, theside segments, the locator segments, or a combination thereof.
 17. Theadjustable tray of claim 13, further comprising: a locking mechanism forreleasably securing said additional tray in a fixed position.
 18. Anadjustable tray for a semiconductor device, comprising: opposing frontand back segments; opposing side segments secured to the front and backsegments to form a frame, at least one side segment comprising alongitudinal channel extending a length of said side segment; opposinglocator segments structured to cooperate for supporting a semiconductordevice in a perpendicular orientation therebetween, at least one locatorsegment comprising a distal end having an element removably engaged withthe longitudinal channel and slidably moveable along a length of thelongitudinal channel, at least one of the locator segments beingmoveable relative to the side segments.
 19. The adjustable tray of claim18, wherein both of the locator segments are moveable relative to theside segments.
 20. An adjustable tray for a semiconductor device,comprising: opposing front and back segments; opposing side segmentssecured to the front and back segments to form a frame, at least oneside segment comprising a longitudinal channel extending a length ofsaid side segment; a first locator segment and opposing second locatorsegment structured to cooperate for supporting a semiconductor device ina perpendicular orientation therebetween, the first locator segmentcomprising a distal end having an element removably engaged with thelongitudinal channel within said side segment and slidably moveablealong a length of the longitudinal channel, and the second locatorsegment being fixedly attached to at least one of the side segments. 21.A modular tray system, comprising: (i) two or more stacked adjustabletrays, each adjustable tray comprising: opposing front and backsegments; opposing side segments secured to the front and back segmentsto form a frame, at least one side segment comprising a longitudinalchannel extending a length of said side segment; and a first locatorsegment and opposing second locator segment structured for supporting asemiconductor device in a perpendicular orientation therebetween, thefirst locator segment comprising an element removably engaged with thelongitudinal channel within said side segment and slidably moveablealong a length of the longitudinal channel; and (ii) an element situatedon at least one of said adjustable trays and structured for maintainingthe two or more trays in a stacked arrangement.
 22. The modular traysystem of claim 21, wherein the stacking element comprises one or morestand-offs.
 23. The modular tray system of claim 22, wherein the elementfor stacking comprises one or more receptacles situated on the frame ofone of the adjustable trays for matingly receiving stand-offs situatedon the other of the adjustable trays.
 24. The modular tray system ofclaim 21, wherein the element for stacking comprises a verticalextension of the side segments of one or both of the adjustable trayshaving standoffs situated thereon.
 25. The modular tray system of claim21, wherein the element for stacking is situated on the front and backsegments, the side segments, the first and second locator segments, or acombination thereof.
 26. The modular tray system of claim 21, furthercomprising: a locking mechanism for releasably securing the stackedtrays-in a fixed position.
 27. A tray for supporting a semiconductordevice, comprising: a frame comprising opposing front and back segmentsand opposing side segments, the side segments having a length, and atleast one side segment comprising a channel extending the length of saidside segment; and opposing locator segments secured to the side segmentsin a spaced apart arrangement, with one of the locator segments beingslidably engaged with the channel by an element situated at a distal endof said locator segment, the locator segments structured to cooperate tosupport a semiconductor device in a perpendicular orientationtherebetween.
 28. A tray for supporting a semiconductor device,comprising: a frame comprising opposing front and back segments andopposing side segments, the side segments having a length, and at leastone side segment comprising a channel extending the length of said sidesegment; and opposing locator segments secured to the side segments in aspaced apart arrangement, with one of the locator segments beingslidably en a ed with the channel by an element situated at a distal endof said locator segment, and the other of the locator segments fixedlyattached to at least one of the side segments, the locator segmentsstructured to cooperate to support a semiconductor device in aperpendicular orientation therebetween.
 29. A tray for supporting asemiconductor device, comprising: a frame comprising opposing front andback segments and opposing side segments, the side segments having alength, and at least one side segment comprising a channel extending thelength of said side segment; and opposing locator segments secured tothe side segments in a spaced apart arrangement, with one of the locatorsegments fixedly attached to at least one of the side segments, and theother of the locator segments comprising a distal end having a guideelement slidably engaged with the channel, the locator segmentsstructured to cooperate to support a semiconductor device in aperpendicular orientation therebetween.
 30. The tray of claim 29,wherein the guide element comprises a flange situated within thechannel.
 31. The tray of claim 29, wherein the guide element comprises aball situated within the channel.
 32. The tray of claim 29, furthercomprising a locking mechanism for releasably securing the guide elementin a fixed position.
 33. The tray of claim 29, further comprising aplurality of stand-offs situated on the frame.
 34. The tray of claim 29,further comprising a plurality of elements situated on the frame andstructured for receiving a stand-off therein.
 35. A stacked tray system,comprising: two or more adjustable trays structured for supporting asemiconductor device in a perpendicular orientation, the trays in astacked arrangement, and each adjustable tray comprising: a framecomprising opposing front and back segments and opposing side segments,the side segments having a length, and at least one side segment havinga channel extending the length of said side segment; opposing locatorsegments secured to the side segments in a spaced apart arrangement,with one of the locator segments being slidably engaged with thechannel; and an element situated on at least one of said adjustabletrays and structured for maintaining the two or more trays in a stackedarrangement.
 36. A stacked tray system, comprising: two or moreadjustable trays structured for supporting a semiconductor device in aperpendicular orientation, the trays in a stacked arrangement, and eachadjustable tray comprising: a frame comprising opposing front and backsegments and opposing side segments, the side segments having a length,and at least one side segment having a channel extending the length ofsaid side segment; opposing locator segments secured to the sidesegments in a spaced apart arrangement, with one of the locator segmentsbeing slidably engaged with the channel; and an element situated on atleast one of said adjustable trays and structured for maintaining aspaced apart arrangement between the semiconductor device situatedwithin a lower tray and the frame of an upper tray stacked on the lowertray.
 37. The system of claim 36, further comprising a lacking mechanismfor releasably securing the stacked trays in a fixed position.
 38. Astacked tray system, comprising: two or more adjustable trays structuredfor supporting a semiconductor device in a perpendicular orientation,the trays in a stacked arrangement, and each adjustable tray comprising:a frame comprising opposing front and back segments and opposing sidesegments, the side segments having a length, and at least one sidesegment having a channel extending the length of said side segment;opposing locator segments secured to the side segments in a spaced apartarrangement, with one of the locator segments being slidably engagedwith the channel; and a plurality of stand-offs situated on at least oneof said adjustable trays and structured for maintaining a spaced apartarrangement between the semiconductor device situated within a lowertray and the frame of an upper tray stacked on the lower tray.
 39. Astacked tray system, comprising: two or more adjustable trays structuredfor supporting a semiconductor device in a perpendicular orientation,the trays in a stacked arrangement, and each adjustable tray comprising:a frame comprising opposing front and back segments and opposing sidesegments, the side segments having a length, and at least one sidesegment having a channel extending the length of said side segment;opposing locator segments secured to the side segments in a spaced apartarrangement, with one of the locator segments being slidably engagedwith the channel; and the side segments of a lower tray having a heighteffective to maintain a spaced apart arrangement between thesemiconductor device situated within the lower tray and the frame of anupper tray stacked on the lower tray.